Tools | |
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Model | LKPF Protoflow |
Room | IoT Innovation Lab |
Work envelope/max capacity | |
Link to manual | https://archive.org/details/manualzilla-id-5907642/page/2/mode/2up |
Related tools | |
Trainer(s) | |
Training Sessions | no training sessions include this tool |
Knowledge keeper(s) | Dave Ostapchuk |
Training document(s) | |
Material Safety Data Sheet (MSDS) | |
Safe Work Procedure | |
Consumables | |
Software | this machine has no software listed |
Equipment type | tool |
IoT Innovation Lab Precautions apply |
You will be working in the IoT Innovation Lab . In order to keep safe from hazards created by you or other workers using any of the tools in this room, the following precautions apply in addition to any other precautions: WORK IN PROGRESS
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LEAD/CHEMICAL/FIRE RISK
This is used for soldering/reflowing a PCB that has surface-mount components.
The PCB requires an application of solder paste and placement of components before placing in the oven. Solder paste is not provided by North Forge, the recommended type and grade for most applications is no-clean thermally stable T3 (T4+ for smaller components/pin pitch).
Double-sided boards are possible in this unit depending on the mass of the components used, size of pad, and amount of solder paste.
If your board has large SMT components (eg. 1206/0805 or SOIC) you can easily apply solder paste by hand to the pads. For smaller components, using a solder paste stencil with the SD-360U_SMT_stencil_printer will make things much easier.